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Proceedings Paper

Si photonics technology for future optical interconnection
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Paper Abstract

Scaling of computing systems require ultra-efficient interconnects with large bandwidth density. Silicon photonics offers a disruptive solution with advantages in reach, energy efficiency and bandwidth density. We review our progress in developing building blocks for ultra-efficient WDM silicon photonic links. Employing microsolder based hybrid integration with low parasitics and high density, we optimize photonic devices on SOI platforms and VLSI circuits on more advanced bulk CMOS technology nodes independently. Progressively, we successfully demonstrated single channel hybrid silicon photonic transceivers at 5 Gbps and 10 Gbps, and 80 Gbps arrayed WDM silicon photonic transceiver using reverse biased depletion ring modulators and Ge waveguide photo detectors. Record-high energy efficiency of less than 100fJ/bit and 385 fJ/bit were achieved for the hybrid integrated transmitter and receiver, respectively. Waveguide grating based optical proximity couplers were developed with low loss and large optical bandwidth to enable multi-layer intra/inter-chip optical interconnects. Thermal engineering of WDM devices by selective substrate removal, together with WDM link using synthetic wavelength comb, we significantly improved the device tuning efficiency and reduced the tuning range. Using these innovative techniques, two orders of magnitude tuning power reduction was achieved. And tuning cost of only a few 10s of fJ/bit is expected for high data rate WDM silicon photonic links.

Paper Details

Date Published: 14 December 2011
PDF: 11 pages
Proc. SPIE 8309, Optical Transmission Systems, Subsystems, and Technologies IX, 83091V (14 December 2011); doi: 10.1117/12.902258
Show Author Affiliations
Xuezhe Zheng, Oracle Labs (United States)
Ashok V. Krishnamoorthy, Oracle Labs (United States)


Published in SPIE Proceedings Vol. 8309:
Optical Transmission Systems, Subsystems, and Technologies IX
Xiang Liu, Editor(s)

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