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Proceedings Paper

A novel 512x8 ROIC with time-delayed-integration for MW infrared focal plane array
Author(s): Jun-ling Zhang; Qi Feng
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Paper Abstract

In this paper a novel 512×8 readout circuit (ROIC) with time delayed integration (TDI) for middle wave (MW) infrared focal plane array (IRFPA) is present. As we known TDI is delicately devised and used in readout circuit to effectively increase the integration time and reduce the photon noise. At the same time, the bucket-brigade device (BBD) structure is commonly used in TDI implementation due to its simplicity and small size in integration. We adopt eight-stage BBD structure to get higher Signal-to-Noise ratio (SNR) and achieve faster image scanning speed for linear IRFPA in the 3μm -5μm spectral band. Because the center distance between each pixel is 28μm×56μm, an input stage based on direct injection (DI) which has high injection ratio and small layout area is proved to be suitable in this design. The detector consists of two segments in a staggered format that reads out synchronously. In order to achieve high flexibility, integration time can be controlled and the defective pixels can be de-selection manually. Some other features such as bidirectional operation, integration time, readout mode, an adaptive charge capacity control method and power consumption are also discussed in this article. The novel 512×8 ROIC is fabricated with 0.6μm double poly double metal CMOS technology and interconnected with MW IRFPA using indium bump. The experiments show that our method can achieve good performance of integration of MW signal both at room temperature and at 77K low temperature. The power consumption of the circuit is about 30mW at 5V supply and the readout clock frequency is up to 4MHz.

Paper Details

Date Published: 8 September 2011
PDF: 10 pages
Proc. SPIE 8193, International Symposium on Photoelectronic Detection and Imaging 2011: Advances in Infrared Imaging and Applications, 81933J (8 September 2011); doi: 10.1117/12.900802
Show Author Affiliations
Jun-ling Zhang, Shanghai Institute of Technical Physics (China)
Qi Feng, Shanghai Institute of Technical Physics (China)


Published in SPIE Proceedings Vol. 8193:
International Symposium on Photoelectronic Detection and Imaging 2011: Advances in Infrared Imaging and Applications
Jeffery J. Puschell; Junhao Chu; Haimei Gong; Jin Lu, Editor(s)

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