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Proceedings Paper

Risk analysis on fabrication process of IRFPA
Author(s): Hong-hai Wang; Xian-sheng Qin
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Paper Abstract

Because of the complexity and long cycle time which the fabrication process of IRFPA chip is, it is impossible that getting a best value through a lot of experiences and tests. Monte Carlo simulation provides a way to analyze and get the probability distribution of the process goal based on limited experience data. So we can maximally avoid taking the poorer parameter and effectively shorten the developing term for IRFPA chip. In this paper, a general fabrication process of IRFPA chip is analyzed by Monte Carlo simulation. According to the function relations between the principal technical indexes and the main parameters of the process, the mathematics model is established. Applying computer software, the process model will be operated based on any random parameter sequence from a random data producer, and then the risk analysis result for the fabrication process of IRFPA chip is obtained. The result not only describes the process goal probability distribution but also provides the optional parameter sequence of given process goal. So that engineer can balance the control points of fabrication process to take suitable technical decision.

Paper Details

Date Published: 8 September 2011
PDF: 8 pages
Proc. SPIE 8193, International Symposium on Photoelectronic Detection and Imaging 2011: Advances in Infrared Imaging and Applications, 819334 (8 September 2011); doi: 10.1117/12.900707
Show Author Affiliations
Hong-hai Wang, Northwestern Polytechnical Univ. (China)
Luoyang Opto-electro Technology Development Ctr. (China)
Xian-sheng Qin, Northwestern Polytechnical Univ. (China)


Published in SPIE Proceedings Vol. 8193:
International Symposium on Photoelectronic Detection and Imaging 2011: Advances in Infrared Imaging and Applications

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