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Proceedings Paper

Optimization design and fabrication of a novel optical-readout uncooled thermal imaging chip
Author(s): Yuxiu Zhou; Hong Zhou; Yanxiang Liu; Yi Wang; Tie Li; Yuelin Wang
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Paper Abstract

Infrared imaging systems are widely used in many fields, so it's of great importance to develop thermal imaging systems of independent intellectual property rights. In this paper, a novel MEMS optical readout uncooled thermal imaging chip was developed. The front-side-etching design with narrow windows shortened the etching time and greatly increased the yield. The theoretical thermal-mechanical analysis was carried out to optimize the structure parameters. Thermal conductance can be adjusted by removing part of the gold layer to compromise between the temperature response and time constant. The finite element simulation demonstrated that the performance of the pixel is in good agreement with the theoretical results, which gives a good support to the theoretical analysis. The pixels were successfully fabricated and released with high yield.

Paper Details

Date Published: 8 September 2011
PDF: 9 pages
Proc. SPIE 8191, International Symposium on Photoelectronic Detection and Imaging 2011: Sensor and Micromachined Optical Device Technologies, 819116 (8 September 2011); doi: 10.1117/12.900520
Show Author Affiliations
Yuxiu Zhou, Shanghai Institute of Microsystem and Information Technology (China)
Graduate Univ. of the Chinese Academy of Sciences (China)
Hong Zhou, Shanghai Institute of Microsystem and Information Technology (China)
Yanxiang Liu, Shanghai Institute of Microsystem and Information Technology (China)
Yi Wang, Shanghai Institute of Microsystem and Information Technology (China)
Tie Li, Shanghai Institute of Microsystem and Information Technology (China)
Yuelin Wang, Shanghai Institute of Microsystem and Information Technology (China)


Published in SPIE Proceedings Vol. 8191:
International Symposium on Photoelectronic Detection and Imaging 2011: Sensor and Micromachined Optical Device Technologies
Yuelin Wang; Huikai Xie; Yufeng Jin, Editor(s)

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