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Proceedings Paper

Study on reliability enhancement testing for InSb focal plane array detector
Author(s): Meng Chao; Peng Jing; Ma Wei
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Paper Abstract

InSb focal plane array (FPA) detectors which are important components of infrared systems have great influence on systems' reliability and development. Few researches have been focused on this field in recent years. Therefore, it is rather essential to carry out reliability test. In the paper, reliability enhancement testing has been carried out on 128×128 elements InSb FPA detectors to discuss the influence of temperature stresses and vibration stresses on structure and performance. Working boundary conditions of InSb FPA detectors were obtained. Aiming at the failure the corresponding improvements were adopted, and reliability of detector was enhanced greatly.

Paper Details

Date Published: 8 September 2011
PDF: 7 pages
Proc. SPIE 8193, International Symposium on Photoelectronic Detection and Imaging 2011: Advances in Infrared Imaging and Applications, 819322 (8 September 2011); doi: 10.1117/12.900272
Show Author Affiliations
Meng Chao, Luoyang Optoelectronic Institute (China)
Peng Jing, Luoyang Optoelectronic Institute (China)
Ma Wei, Luoyang Optoelectronic Institute (China)


Published in SPIE Proceedings Vol. 8193:
International Symposium on Photoelectronic Detection and Imaging 2011: Advances in Infrared Imaging and Applications
Jeffery J. Puschell; Junhao Chu; Haimei Gong; Jin Lu, Editor(s)

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