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Proceedings Paper

New yield-aware mask strategies
Author(s): Kwangok Jeong; Andrew B. Kahng; Christopher J. Progler
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Paper Abstract

In this paper, we provide new yield-aware mask strategies to mitigate emerging variability and defectivity challenges. To address variability, we analyze CD variability with respect to reticle size, and its impact on parametric yield. With a cost model that incorporates mask, wafer, and processing cost considering throughput, yield, and manufacturing volume, we assess various reticle strategies (e.g., single layer reticle (SLR), multiple layer reticle (MLR), and small and large size) considering field-size dependent parametric yield. To address defectivity, we compare parametric yield due to EUV mask blank defects for various reticle strategies in conjunction with reticle floorplan optimizations such as shifting of the mask pattern within a mask blank to avoid defects being superposed by performance-critical patterns of a design.

Paper Details

Date Published: 19 May 2011
PDF: 12 pages
Proc. SPIE 8081, Photomask and Next-Generation Lithography Mask Technology XVIII, 80810P (19 May 2011); doi: 10.1117/12.899295
Show Author Affiliations
Kwangok Jeong, Univ. of California, San Diego (United States)
Andrew B. Kahng, Univ. of California, San Diego (United States)
Christopher J. Progler, Photronics, Inc. (United States)

Published in SPIE Proceedings Vol. 8081:
Photomask and Next-Generation Lithography Mask Technology XVIII
Toshio Konishi, Editor(s)

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