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Proceedings Paper

Dry etching performance of advanced EUV mask blanks
Author(s): John Whang; Madhavi Chandrachood; Emily Gallagher; Tom Faure; Michael Grimbergen; Shaun Crawford; Keven Yu; T. Y .B Leung; Richard Wistrom; Amitabh Sabharwal; Jeff Chen; Banqiu Wu
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Paper Abstract

Mask defectivity is often highlighted as one of the barriers to a manufacturable EUV solution. As EUV lithography matures, other components of mask making also emerge as key focus areas in the industry: critical dimension (CD) control, film variability, selectivity, and profile tolerance. Mask materials and specifications continue to evolve to meet the unique challenges of EUV lithography, creating the need for etch capabilities that can keep pace with the latest developments. In this study, the performance of a new EUV mask etch system will be evaluated using a variety of mask blanks to determine the relative performance of each blank type. Etch contributions to mean to target (MTT), CDU, linearity, selectivity, capping layer uniformity, line edge roughness (LER), and profile quality will be characterized to determine tool performance. The new system will also be used to demonstrate multilayer etching capabilities, important for opaque frame and alternating phase shift applications. A comprehensive summary of the etch performance of various EUV films and the readiness for manufacturing applications will be provided.

Paper Details

Date Published: 13 October 2011
PDF: 6 pages
Proc. SPIE 8166, Photomask Technology 2011, 81661W (13 October 2011); doi: 10.1117/12.898815
Show Author Affiliations
John Whang, IBM Microelectronics (United States)
Madhavi Chandrachood, Applied Materials, Inc. (United States)
Emily Gallagher, IBM Microelectronics (United States)
Tom Faure, IBM Microelectronics (United States)
Michael Grimbergen, Applied Materials, Inc. (United States)
Shaun Crawford, IBM Microelectronics (United States)
Keven Yu, Applied Materials, Inc. (United States)
T. Y .B Leung, Applied Materials, Inc. (United States)
Richard Wistrom, IBM Microelectronics (United States)
Amitabh Sabharwal, Applied Materials, Inc. (United States)
Jeff Chen, Applied Materials, Inc. (United States)
Banqiu Wu, Applied Materials, Inc. (United States)

Published in SPIE Proceedings Vol. 8166:
Photomask Technology 2011
Wilhelm Maurer; Frank E. Abboud, Editor(s)

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