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Proceedings Paper

Megasonic cleaning: possible solutions for 22nm node and beyond
Author(s): Hrishi Shende; Sherjang Singh; James Baugh; Raunak Mann; Uwe Dietze; Peter Dress
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Paper Abstract

Megasonic energy transfer to the photomask surface is indirectly controlled by process parameters that provide an effective handle to physical force distribution on the photomask surface. A better understanding of the influence of these parameters on the physical force distribution and their effect on pattern damage of fragile mask features can help optimize megasonic energy transfer as well as assist in extending this cleaning technology beyond the 22nm node. In this paper we have specifically studied the effect of higher megasonic frequencies (3 & 4MHz) and media gasification on pattern damage; the effect of cleaning chemistry, media volume flow rate, process time, and nozzle distance to the mask surface during the dispense is also discussed. Megasonic energy characterization is performed by measuring the acoustic energy as well as cavitation created by megasonic energy through sonoluminescence measurements.

Paper Details

Date Published: 14 October 2011
PDF: 10 pages
Proc. SPIE 8166, Photomask Technology 2011, 816614 (14 October 2011); doi: 10.1117/12.898409
Show Author Affiliations
Hrishi Shende, MP Mask Technology Ctr., LLC (United States)
Sherjang Singh, SUSS MicroTec Inc. (United States)
James Baugh, MP Mask Technology Ctr., LLC (United States)
Raunak Mann, MP Mask Technology Ctr., LLC (United States)
Uwe Dietze, SUSS MicroTec Inc. (United States)
Peter Dress, HamaTech APE GmbH (Germany)


Published in SPIE Proceedings Vol. 8166:
Photomask Technology 2011
Wilhelm Maurer; Frank E. Abboud, Editor(s)

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