Share Email Print

Proceedings Paper

Wafer-level micro-optics: trends in manufacturing, testing, and packaging
Author(s): Reinhard Voelkel; Kenneth J. Weible; Martin Eisner
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Micro-optics is an indispensable key enabling technology (KET) for many applications today. The important role of micro-optical components is based on three different motivations: miniaturization, high functionality and packaging aspects. It is obvious that miniaturized systems require micro-optics for light focusing, light shaping and imaging. More important for industrial applications is the high functionality of micro-optics that allows combining these different functions in one element. In DUV Lithography Steppers and Scanners an extremely precise beam shaping of the Excimer laser profile is required. High-precision diffractive optical elements are well suited for this task. For Wafer-Level Cameras (WLC) and fiber optical systems the packaging aspects are more important. Wafer-Level Micro-Optics technology allows manufacturing and packaging some thousands of sub-components in parallel. We report on the state of the art in wafer-based manufacturing, testing and packaging.

Paper Details

Date Published: 30 September 2011
PDF: 12 pages
Proc. SPIE 8169, Optical Fabrication, Testing, and Metrology IV, 81690C (30 September 2011); doi: 10.1117/12.897114
Show Author Affiliations
Reinhard Voelkel, SUSS MicroOptics SA (Switzerland)
Kenneth J. Weible, SUSS MicroOptics SA (Switzerland)
Martin Eisner, SUSS MicroOptics SA (Switzerland)

Published in SPIE Proceedings Vol. 8169:
Optical Fabrication, Testing, and Metrology IV
Angela Duparré; Roland Geyl, Editor(s)

© SPIE. Terms of Use
Back to Top