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Proceedings Paper

Addressing 3D metrology challenges by using a multiple detector CDSEM
Author(s): Mitsuo Hiroyama; Tsutomu Murakawa; Masayuki Kuribara; Toshimichi Iwai; Minoru Soma; Ikuo Iko; Masahiro Seyama; Jun Matsumoto; Takayuki Nakamura; Hidemitsu Hakii; Isao Yonekura; Masashi Kawashita; Yasushi Nishiyama; Keishi Tanaka; Kenji Komoto
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Paper Abstract

In next generation lithography (NGL) for the 22nm node and beyond, the three dimensional (3D) shape measurements of side wall angle (SWA) and height of the photomask pattern will become critical for controlling the exposure characteristics and wafer printability. Until today, cross-section SEM (X-SEM) and Atomic Force Microscope (AFM) methods are used to make 3D measurements, however, these techniques require time consuming preparation and observation. This paper presents an innovative technology for 3D measurement using a multiple detector CDSEM and reports its accuracy and precision.

Paper Details

Date Published: 14 October 2011
PDF: 12 pages
Proc. SPIE 8166, Photomask Technology 2011, 81661R (14 October 2011); doi: 10.1117/12.896982
Show Author Affiliations
Mitsuo Hiroyama, Advantest Corp. (Japan)
Tsutomu Murakawa, Advantest Corp. (Japan)
Masayuki Kuribara, Advantest Corp. (Japan)
Toshimichi Iwai, Advantest Corp. (Japan)
Minoru Soma, Advantest Corp. (Japan)
Ikuo Iko, Advantest Corp. (Japan)
Masahiro Seyama, Advantest Corp. (Japan)
Jun Matsumoto, Advantest Corp. (Japan)
Takayuki Nakamura, Advantest Corp. (Japan)
Hidemitsu Hakii, Toppan Printing Co., Ltd. (Japan)
Isao Yonekura, Toppan Printing Co., Ltd. (Japan)
Masashi Kawashita, Toppan Printing Co., Ltd. (Japan)
Yasushi Nishiyama, Toppan Printing Co., Ltd. (Japan)
Keishi Tanaka, Toppan Printing Co., Ltd. (Japan)
Kenji Komoto, Toppan Printing Co., Ltd. (Japan)


Published in SPIE Proceedings Vol. 8166:
Photomask Technology 2011
Wilhelm Maurer; Frank E. Abboud, Editor(s)

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