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Proceedings Paper

High performance LWIR microbolometer with Si/SiGe quantum well thermistor and wafer level packaging
Author(s): Audun Roer; Adriana Lapadatu; Martin Bring; Erik Wolla; Erling Hohler; Gjermund Kittilsland
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Paper Abstract

An uncooled microbolometer with peak responsivity in the long wave infrared region of the electromagnetic radiation is developed at Sensonor Technologies. It is a 384 x 288 focal plane array with a pixel pitch of 25μm, based on monocrystalline Si/SiGe quantum wells as IR sensitive material. The high sensitivity (TCR) and low 1/f noise are the main performance characteristics of the product. The frame rate is maximum 60Hz and the output interface is digital (LVDS). The quantum well thermistor material is transferred to the read-out integrated circuit (ROIC) by direct wafer bonding. The ROIC wafer containing the released pixels is bonded in vacuum with a silicon cap wafer, providing hermetic encapsulation at low cost. The resulting wafer stack is mounted in a standard ceramic package. In this paper the architecture of the pixels and the ROIC, the wafer packaging and the electro-optical measurement results are presented.

Paper Details

Date Published: 28 September 2011
PDF: 8 pages
Proc. SPIE 8185, Electro-Optical and Infrared Systems: Technology and Applications VIII, 818507 (28 September 2011); doi: 10.1117/12.896882
Show Author Affiliations
Audun Roer, Sensonor Technologies AS (Norway)
Adriana Lapadatu, Sensonor Technologies AS (Norway)
Martin Bring, Sensonor Technologies AS (Norway)
Erik Wolla, Sensonor Technologies AS (Norway)
Erling Hohler, Sensonor Technologies AS (Norway)
Gjermund Kittilsland, Sensonor Technologies AS (Norway)

Published in SPIE Proceedings Vol. 8185:
Electro-Optical and Infrared Systems: Technology and Applications VIII
David A. Huckridge; Reinhard R. Ebert, Editor(s)

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