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Proceedings Paper

Study on the soft defects related to dry etch process of phase shift mask
Author(s): Young-Jin An; Jong-Min Kim; Byung-Sun Kang; Dong-Heok Lee; Sang-Soo Choi
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Paper Abstract

In mask manufacturing process, some soft defects generated through co-interaction of dry etch and PR coating are hard to be removed in the conventional cleaning or repair process. It is on MoSi layer with smooth surface (lower roughness than MoSi), very thin and higher transmittance than MoSi film, it looks like half-tone pin-hole. Also, the defects are hard to detect in the conventional PSM inspection tool because of its thin and higher transmittance. In this paper, the root cause and control method of dry etch related half-tone pin-hole like soft defect is studied.

Paper Details

Date Published: 14 October 2011
PDF: 8 pages
Proc. SPIE 8166, Photomask Technology 2011, 81661L (14 October 2011); doi: 10.1117/12.896776
Show Author Affiliations
Young-Jin An, PKL Co., Ltd. (Korea, Republic of)
Jong-Min Kim, PKL Co., Ltd. (Korea, Republic of)
Byung-Sun Kang, PKL Co., Ltd. (Korea, Republic of)
Dong-Heok Lee, PKL Co., Ltd. (Korea, Republic of)
Sang-Soo Choi, PKL Co., Ltd. (Korea, Republic of)


Published in SPIE Proceedings Vol. 8166:
Photomask Technology 2011
Wilhelm Maurer; Frank E. Abboud, Editor(s)

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