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Proceedings Paper

Sidewall slope sensitivity of CD-AFM
Author(s): Aaron Cordes; Benjamin Bunday; Eric Cottrell
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Paper Abstract

In this paper, we explore the sensitivity of three-dimensional atomic force microscopy to incremental variation in the sidewall angle of near-vertical features. Measurement results are presented from a specially constructed wafer with continuous variation in sidewall slope across a range of angles just above and below vertical. This sample was scanned with a variety of both tip shapes and sizes using two different scan modes. From the results, we are able to derive cutoff limits for measuring near-vertical angles using aggressive scanning modes and the relative biases of different modes and tips in measuring a range of sidewall angles. This provides information about the measurement limitations of differing instrument configurations, each configuration consisting of a combination of tip and scan mode and sensitivity demarcated in terms of the ability to detect changes in the slope and relative accuracy of the measurement.

Paper Details

Date Published: 20 September 2011
PDF: 8 pages
Proc. SPIE 8105, Instrumentation, Metrology, and Standards for Nanomanufacturing, Optics, and Semiconductors V, 810506 (20 September 2011); doi: 10.1117/12.896344
Show Author Affiliations
Aaron Cordes, SEMATECH North (United States)
Benjamin Bunday, SEMATECH North (United States)
Eric Cottrell, Bruker AXS, Inc. (United States)

Published in SPIE Proceedings Vol. 8105:
Instrumentation, Metrology, and Standards for Nanomanufacturing, Optics, and Semiconductors V
Michael T. Postek, Editor(s)

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