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Proceedings Paper

Next-generation ionomer encapsulants for thin film technology
Author(s): Robin Czyzewicz; C. Anthony Smith
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Paper Abstract

The characteristic properties of newly developed ionomer-based encapsulants are highlighted along with an in-depth analysis of moisture ingress, electrical and mechanical properties. The mechanical properties of these encapsulants with their high stiffness and strength have been found to allow the use of thinner glass and a possible shift from tempered to annealed glass. Lower-cost mounting options may be explored through full-module stress/deflection measurement capability and competencies developed in world-class finite-element modeling of system parameters. The superior electrical and moisture properties may allow modules to be produced without the use of an additional edge seal. These new materials have improved melt flow properties when compared to other encapsulant families such as EVA or PVB. This allows for faster processing which reduces production cost by shortening the lamination cycle. During the lamination process the sheets show excellent dimensional stability and low shrinkage behavior; and there is no need for curing, thus energy costs are lower due to lower lamination temperature. As advancement of technology proceeds across the entire PV industry, next generation ionomer encapsulants have been developed to keep up with the pace.

Paper Details

Date Published: 21 September 2011
PDF: 11 pages
Proc. SPIE 8112, Reliability of Photovoltaic Cells, Modules, Components, and Systems IV, 81120F (21 September 2011); doi: 10.1117/12.894257
Show Author Affiliations
Robin Czyzewicz, E.I. du Pont de Nemours & Co., Inc. (United States)
C. Anthony Smith, E.I. du Pont de Nemours & Co., Inc. (United States)


Published in SPIE Proceedings Vol. 8112:
Reliability of Photovoltaic Cells, Modules, Components, and Systems IV
Neelkanth G. Dhere; John H. Wohlgemuth; Kevin W. Lynn, Editor(s)

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