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Proceedings Paper

Tungsten nanostructured thin films obtained via HFCVD
Author(s): O. Goiz; F. Chávez; P. Zaca-Morán; J. G. Ortega-Mendoza; G. F. Pérez-Sánchez; N. Morales; C. Felipe; R. Peña-Sierra
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Paper Abstract

By using the Hot Filament Chemical Vapor Deposition (HFCVD) technique tungsten thin films were deposited on amorphous quartz substrates. To achieve this, a tungsten filament was heated at 1300 °C during 30 minutes maintaining a constant pressure inside the chamber at 460 mTorr and substrate at 700 °C. Transition from tungsten oxide deposits to tungsten thin films, by varying the substrate temperature, were characterized by means of Scanning Electron Microscope (SEM), Atomic Force Microscope (AFM), X-Ray Diffraction and, micro-Raman spectroscopy. The SEM micrographs reveal that the tungsten films have no more than 200 nm in thickness while XRD show evidence of the films crystallize in the á-tungsten modification. On the other hand, AFM shows that the tungsten thin films exhibit a uniform and smooth surface composed with semi-spherical shapes whose diameters are below than 50 nm. Furthermore, to the naked eye, the as-deposited tungsten films exhibit a high mirror-like appearance.

Paper Details

Date Published: 26 September 2011
PDF: 6 pages
Proc. SPIE 8104, Nanostructured Thin Films IV, 810415 (26 September 2011); doi: 10.1117/12.893850
Show Author Affiliations
O. Goiz, Ctr. de Investigacion y de Estudios Avanzados del IPN (Mexico)
F. Chávez, Benemérita Univ. Autónoma de Puebla (Mexico)
P. Zaca-Morán, Benemérita Univ. Autónoma de Puebla (Mexico)
J. G. Ortega-Mendoza, Benemérita Univ. Autónoma de Puebla (Mexico)
G. F. Pérez-Sánchez, Benemérita Univ. Autónoma de Puebla (Mexico)
N. Morales, Benemérita Univ. Autónoma de Puebla (Mexico)
C. Felipe, Ctr. Interdisciplinario de Investigaciones y Estudios sobre Medio Ambiente y Desarrollo (Mexico)
R. Peña-Sierra, Ctr. de Investigacion y de Estudios Avanzados del IPN (Mexico)


Published in SPIE Proceedings Vol. 8104:
Nanostructured Thin Films IV
Raúl J. Martín-Palma; Yi-Jun Jen; Tom G. Mackay, Editor(s)

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