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Proceedings Paper

Package technology for microcavities
Author(s): Wen-Dong Zhang; Ying-Zhan Yan; Jun Liu; Shu-Bin Yan; Chen-Yang Xue; Ji-Jun Xiong
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Paper Abstract

Although Microcavities are promising in a variety of novel devices, there is slow development in microcavity based practical devices due to the lack of the package technology. In this paper, for the first time, we demonstrate the package technology for the microcavity coupling system to promote the development of the microcavity based practical applications. The package process are illustrated in detail. The changes which result from the package are also discussed. In addition, the advantages of the packaged structure are characterized, including the Q maintenance, robustness and the convenience. These advantages make this packaged structure promising in microcavity based practical devices.

Paper Details

Date Published: 27 September 2011
PDF: 6 pages
Proc. SPIE 8126, Optical Manufacturing and Testing IX, 81261G (27 September 2011); doi: 10.1117/12.893474
Show Author Affiliations
Wen-Dong Zhang, North Univ. of China (China)
Ying-Zhan Yan, North Univ. of China (China)
Jun Liu, North Univ. of China (China)
Shu-Bin Yan, North Univ. of China (China)
Chen-Yang Xue, North Univ. of China (China)
Ji-Jun Xiong, North Univ. of China (China)

Published in SPIE Proceedings Vol. 8126:
Optical Manufacturing and Testing IX
James H. Burge; Oliver W. Fähnle; Ray Williamson, Editor(s)

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