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Proceedings Paper

Inspection of processes during silicon wafer sawing using low coherence interferometry in the near infrared wavelength region
Author(s): Kay Gastinger; Lars Johnsen; Ove Simonsen; Astrid Aksnes
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Paper Abstract

Multi-wire sawing of silicon wafers is a tribological process. Slurry consisting of small silicon carbide particles embedded in polyethyleneglycol carries out the abrasive material removal process. During this process small silicon chips are removed from the bulk material. Low coherence interferometry (LCI) is widely used for high accuracy surface topography measurements of materials. This paper presents an application of LCI where the surface of a material (silicon) is inspected from the inside. Light in the near infrared (NIR) wavelength region is used. High spatial resolution is necessary to be able to observe the processes on the micro scale. Therefore a modified solid immersion approach is suggested. That makes it possible to reach a spatial resolution in the range of the illumination wavelength. The topography changes produced by the chippings are in the range of some micrometers. To be able to estimate the volumes of the Si chippings interferometric phase measurements are applied.

Paper Details

Date Published: 27 May 2011
PDF: 9 pages
Proc. SPIE 8082, Optical Measurement Systems for Industrial Inspection VII, 80820U (27 May 2011); doi: 10.1117/12.889498
Show Author Affiliations
Kay Gastinger, Norwegian Univ. of Science and Technology (Norway)
Lars Johnsen, SINTEF (Norway)
Ove Simonsen, Norwegian Univ. of Science and Technology (Norway)
Astrid Aksnes, Norwegian Univ. of Science and Technology (Norway)


Published in SPIE Proceedings Vol. 8082:
Optical Measurement Systems for Industrial Inspection VII
Peter H. Lehmann; Wolfgang Osten; Kay Gastinger, Editor(s)

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