Share Email Print
cover

Proceedings Paper

Experimental setup for the coating of chlorosilane based self assembling monolayers to reduce stiction in MEMS devices
Author(s): H. Steiner; M. Sachse; J. Schalko; W. Hortschitz; F. Kohl; A. Jachimowicz
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

An often reported problem during production and operation of silicon MEMS is stiction. It describes the sticking of movable MEMS parts to surrounding structures. The probability of the occurrence of stiction is linked to the surface energy of the MEMS. Self assembling monolayers can be used to reduce the surface energy and therefore the probability of stiction. These monolayers have to resist high temperatures up to 400°C to be compatible with various micro-production processes, e.g., eutectic bonding. Several groups tried to coat such monolayers with different success and results. One problem is the instability of the coating method due to water contaminations of the coating solution. To circumvent this error source, an experimental setup was designed and built up to minimize the water content of the monolayer solvent and ensures reproducible conditions during the coating process. The required set of liquids is piped through a system of valves and tubes to rinse a trench with a silicon die. To avoid contamination of the liquids with water, the setup is partly placed in a box flushed with nitrogen. With this experimental setup, the surface energy γs of the MEMS structures had been reduced from 18.1 mJ/m2 to 33.1 μJ/m2 and 36.6 μJ/m2 for FDTS and DDMS, respectively.

Paper Details

Date Published: 5 May 2011
PDF: 9 pages
Proc. SPIE 8066, Smart Sensors, Actuators, and MEMS V, 806624 (5 May 2011); doi: 10.1117/12.887630
Show Author Affiliations
H. Steiner, Institute for Integrated Sensor Systems (Austria)
M. Sachse, Institute for Integrated Sensor Systems (Austria)
J. Schalko, Institute for Integrated Sensor Systems (Austria)
Vienna Univ. of Technology (Austria)
W. Hortschitz, Institute for Integrated Sensor Systems (Austria)
F. Kohl, Institute for Integrated Sensor Systems (Austria)
A. Jachimowicz, Vienna Univ. of Technology (Austria)


Published in SPIE Proceedings Vol. 8066:
Smart Sensors, Actuators, and MEMS V
Ulrich Schmid; José Luis Sánchez-Rojas; Monika Leester-Schaedel, Editor(s)

© SPIE. Terms of Use
Back to Top