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Proceedings Paper

Investigation on micromachining technologies for the realization of LTCC devices and systems
Author(s): T. Haas; C. Zeilmann; A. Bittner; U. Schmid
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Paper Abstract

Low temperature co-fired ceramics (LTCC) has established as a widespread platform for advanced functional ceramic devices in different applications, such as in the space and aviation sector, for micro machined sensors as well as in micro fluidics. This is due to high reliability, excellent physical properties, especially in the high frequency range, and the possibility to integrate passive components in the monolithic LTCC body, offering the potential for a high degree of miniaturisation. However, for further improvement of this technology and for an ongoing increase of the integration level, the realization of miniaturized structures is of utmost importance. Therefore, novel techniques for micro-machining are required providing channel structures and cavities inside the glass-ceramic body, enabling for further application scenarios. Those techniques are punching, laser cutting and embossing. One of the most limitations of LTCC is the poor thermal conductivity. Hence, the possibility to integrate channels enables innovative active cooling approaches using fluidic media for heat critical devices. Doing so, a by far better cooling effect can be achieved than by passive devices as heat spreaders or heat sinks. Furthermore, the realization of mechanic devices as integrated pressure sensors for operation under harsh environmental conditions can be realized by integrating the membrane directly into the ceramic body. Finally, for high power devices substantial improvement can be provided by filling those channel structures with electrical conductive material, so that the resistivity can be decreased drastically without affecting the topography of the ceramics.

Paper Details

Date Published: 5 May 2011
PDF: 6 pages
Proc. SPIE 8066, Smart Sensors, Actuators, and MEMS V, 80661W (5 May 2011); doi: 10.1117/12.887603
Show Author Affiliations
T. Haas, Micro Systems Engineering GmbH (Germany)
C. Zeilmann, Micro Systems Engineering GmbH (Germany)
A. Bittner, Vienna Univ. of Technology (Austria)
U. Schmid, Vienna Univ. of Technology (Austria)


Published in SPIE Proceedings Vol. 8066:
Smart Sensors, Actuators, and MEMS V
Ulrich Schmid; José Luis Sánchez-Rojas; Monika Leester-Schaedel, Editor(s)

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