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Proceedings Paper

Wafer bonding for MEMS and CMOS integration
Author(s): V. Dragoi; E. Pabo; J. Burggraf; G. Mittendorfer
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Paper Abstract

Wafer bonding became during past decade an important technology for MEMS manufacturing and wafer-level 3D integration applications. The increased complexity of the MEMS devices brings new challenges to the processing techniques. In MEMS manufacturing wafer bonding can be used for integration of the electronic components (e.g. CMOS circuitries) with the mechanical (e.g. resonators) or optical components (e.g. waveguides, mirrors) in a single, wafer-level process step. However, wafer bonding with CMOS wafers brings additional challenges due to very strict requirements in terms of process temperature and contamination. These challenges were identified and wafer bonding process solutions will be presented illustrated with examples.

Paper Details

Date Published: 5 May 2011
PDF: 10 pages
Proc. SPIE 8066, Smart Sensors, Actuators, and MEMS V, 806622 (5 May 2011); doi: 10.1117/12.886699
Show Author Affiliations
V. Dragoi, EV Group (Austria)
E. Pabo, EV Group Inc. (United States)
J. Burggraf, EV Group (Austria)
G. Mittendorfer, EV Group (Austria)

Published in SPIE Proceedings Vol. 8066:
Smart Sensors, Actuators, and MEMS V
Ulrich Schmid; José Luis Sánchez-Rojas; Monika Leester-Schaedel, Editor(s)

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