Share Email Print
cover

Proceedings Paper

Measurement of Young's modulus and residual stress of thin SiC layers for MEMS high temperature applications
Author(s): Oliver Pabst; Michael Schiffer; Ernst Obermeier; Tolga Tekin; Klaus Dieter Lang; Ha-Duong Ngo
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Silicon carbide (SiC) is a promising material for applications in harsh environments. Standard silicon (Si) microelectromechanical systems (MEMS) are limited in operating temperature to temperatures below 130 °C for electronic devices and below 600 °C for mechanical devices. Due to its large bandgap SiC enables MEMS with significantly higher operating temperatures. Furthermore, SiC exhibits high chemical stability and thermal conductivity. Young's modulus and residual stress are important mechanical properties for the design of sophisticated SiC-based MEMS devices. In particular, residual stresses are strongly dependent on the deposition conditions. Literature values for Young's modulus range from 100 to 400 GPa, and residual stresses range from 98 to 486 MPa. In this paper we present our work on investigating Young's modulus and residual stress of SiC films deposited on single crystal bulk silicon using bulge testing. This method is based on measurement of pressure-dependent membrane deflection. Polycrystalline as well as single crystal cubic silicon carbide samples are studied. For the samples tested, average Young's modulus and residual stress measured are 417 GPa and 89 MPa for polycrystalline samples. For single crystal samples, the according values are 388 GPa and 217 MPa. These results compare well with literature values.

Paper Details

Date Published: 5 May 2011
PDF: 9 pages
Proc. SPIE 8066, Smart Sensors, Actuators, and MEMS V, 806608 (5 May 2011); doi: 10.1117/12.886453
Show Author Affiliations
Oliver Pabst, Fraunhofer Institute for Applied Optics and Precision Engineering (Germany)
Friedrich Schiller Univ. Jena (Germany)
Michael Schiffer, TDK-EPCOS Corp. (Germany)
Ernst Obermeier, Technical Univ. of Berlin (Germany)
Tolga Tekin, Technical Univ. of Berlin (Germany)
Klaus Dieter Lang, Technical Univ. of Berlin (Germany)
Ha-Duong Ngo, Technical Univ. of Berlin (Germany)


Published in SPIE Proceedings Vol. 8066:
Smart Sensors, Actuators, and MEMS V
Ulrich Schmid; José Luis Sánchez-Rojas; Monika Leester-Schaedel, Editor(s)

© SPIE. Terms of Use
Back to Top