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Proceedings Paper

An AOI approach for IC lead index auto-verification
Author(s): Der-Baau Perng; Guei-Ci Chang; Shu-Ming Lee; Ssu-Han Chen
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Paper Abstract

To wire-bond automatically, the IC lead positions on the CAD drawing and the corresponding ones on the extracted substrate image should be pre-verified. This paper proposed an AOI approach for IC lead index auto-verification which conquered the lead shape distortion, golden exposed, shifting, rotation, and scaling difficulties of extracted substrate image. Experimentations revealed that the proposed AOI approach can accurately verify the corresponding leads between a CAD drawing and the extracted substrate image with high repeatability.

Paper Details

Date Published: 28 December 2010
PDF: 13 pages
Proc. SPIE 7544, Sixth International Symposium on Precision Engineering Measurements and Instrumentation, 754470 (28 December 2010); doi: 10.1117/12.886015
Show Author Affiliations
Der-Baau Perng, National Chiao Tung Univ. (Taiwan)
Guei-Ci Chang, National Chiao Tung Univ. (Taiwan)
Shu-Ming Lee, National Chiao Tung Univ. (Taiwan)
Ssu-Han Chen, National Chiao Tung Univ. (Taiwan)


Published in SPIE Proceedings Vol. 7544:
Sixth International Symposium on Precision Engineering Measurements and Instrumentation
Jiubin Tan; Xianfang Wen, Editor(s)

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