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Proceedings Paper

Parameters of hot embossing in microfluidic chips
Author(s): Wei Wang; Shaofeng Li; Li Tian; Jianmin Li; Tian Qin; Xiaowei Liu
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Paper Abstract

Twice hot-embossing, a new technology of hot-embossing proposed, can effectively reduce the error of hot forming caused by hot equipment. The depth / width ratio of micro-channel on the metal concave-mother-template is an influence parameter of twice hot-embossing; Optimization of the parameters, the PMMA convex-template has been produced in 120°C, ± 6MPa by twice hot-embossing.

Paper Details

Date Published: 31 December 2010
PDF: 6 pages
Proc. SPIE 7544, Sixth International Symposium on Precision Engineering Measurements and Instrumentation, 75446B (31 December 2010); doi: 10.1117/12.885666
Show Author Affiliations
Wei Wang, Harbin Institute of Technology (China)
Shaofeng Li, Harbin Institute of Technology (China)
Li Tian, Harbin Institute of Technology (China)
Jianmin Li, Harbin Institute of Technology (China)
Tian Qin, Harbin Institute of Technology (China)
Xiaowei Liu, Harbin Institute of Technology (China)


Published in SPIE Proceedings Vol. 7544:
Sixth International Symposium on Precision Engineering Measurements and Instrumentation
Jiubin Tan; Xianfang Wen, Editor(s)

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