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Proceedings Paper

Advanced optical techniques for the measurement of the internal geometry of MEMS structures
Author(s): Wenjuan Sun; Richard K. Leach
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Paper Abstract

Many modern MEMS devices incorporate multi-layered structures. However, the metrology of such structures is struggling to keep pace with their manufacture. In this paper the measurement of the internal geometry of MEMS devices using optical coherence tomography and infra-red confocal microscopy is discussed. Both measurement techniques provide non-contact, non-invasive measurements of internal geometry. However, both techniques use relatively new technologies for measuring internal geometry and the understanding of their capabilities is limited. The study reported in this paper has mainly focused on the thickness measurement of layers. The performance of both instruments has been investigated by measuring a 50 μm thick plate artefact that had been calibrated using a traceable stylus instrument. The standard uncertainties associated with the measurements of the artefact are 0.391 μm for optical coherence tomography and 1.085 μm for infra-red confocal microscopy. Finally, the capabilities of the two instruments have been highlighted by measuring a pressure sensor containing multi-layered structures. These measurements demonstrated that both instruments have the ability to measure the thickness of layers and to image internal geometrical structures.

Paper Details

Date Published: 29 December 2010
PDF: 5 pages
Proc. SPIE 7544, Sixth International Symposium on Precision Engineering Measurements and Instrumentation, 754461 (29 December 2010); doi: 10.1117/12.885607
Show Author Affiliations
Wenjuan Sun, National Physical Lab. (United Kingdom)
Richard K. Leach, National Physical Lab. (United Kingdom)


Published in SPIE Proceedings Vol. 7544:
Sixth International Symposium on Precision Engineering Measurements and Instrumentation

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