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Proceedings Paper

Using synchrotron light to accelerate EUV resist and mask materials learning
Author(s): Patrick Naulleau; Christopher N. Anderson; Lorie-Mae Baclea-an; Paul Denham; Simi George; Kenneth A. Goldberg; Gideon Jones; Brittany McClinton; Ryan Miyakawa; Iacopo Mochi; Warren Montgomery; Seno Rekawa; Tom Wallow
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Paper Abstract

As commercialization of extreme ultraviolet lithography (EUVL) progresses, direct industry activities are being focused on near term concerns. The question of long term extendibility of EUVL, however, remains crucial given the magnitude of the investments yet required to make EUVL a reality. Extendibility questions are best addressed using advanced research tools such as the SEMATECH Berkeley microfield exposure tool (MET) and actinic inspection tool (AIT). Utilizing Lawrence Berkeley National Laboratory's Advanced Light Source facility as the light source, these tools benefit from the unique properties of synchrotron light enabling research at nodes generations ahead of what is possible with commercial tools. The MET for example uses extremely bright undulator radiation to enable a lossless fully programmable coherence illuminator. Using such a system, resolution enhancing illuminations achieving k1 factors of 0.25 can readily be attained. Given the MET numerical aperture of 0.3, this translates to an ultimate resolution capability of 12 nm. Using such methods, the SEMATECH Berkeley MET has demonstrated resolution in resist to 16-nm half pitch and below in an imageable spin-on hard mask. At a half pitch of 16 nm, this material achieves a line-edge roughness of 2 nm with a correlation length of 6 nm. These new results demonstrate that the observed stall in ultimate resolution progress in chemically amplified resists is a materials issue rather than a tool limitation. With a resolution limit of 20-22 nm, the CAR champion from 2008 remains as the highest performing CAR tested to date. To enable continued advanced learning in EUV resists, SEMATECH has initiated a plan to implement a 0.5 NA microfield tool at the Advanced Light Source synchrotron facility. This tool will be capable of printing down to 8-nm half pitch.

Paper Details

Date Published: 2 April 2011
PDF: 10 pages
Proc. SPIE 7985, 27th European Mask and Lithography Conference, 798509 (2 April 2011); doi: 10.1117/12.885420
Show Author Affiliations
Patrick Naulleau, Lawrence Berkeley National Lab. (United States)
Christopher N. Anderson, Lawrence Berkeley National Lab. (United States)
Lorie-Mae Baclea-an, Lawrence Berkeley National Lab. (United States)
Paul Denham, Lawrence Berkeley National Lab. (United States)
Simi George, Lawrence Berkeley National Lab. (United States)
Kenneth A. Goldberg, Lawrence Berkeley National Lab. (United States)
Gideon Jones, Lawrence Berkeley National Lab. (United States)
Brittany McClinton, Univ. of California, Berkeley (United States)
Ryan Miyakawa, Univ. of California, Berkeley (United States)
Iacopo Mochi, Lawrence Berkeley National Lab. (United States)
Warren Montgomery, SEMATECH (United States)
Seno Rekawa, Lawrence Berkeley National Lab. (United States)
Tom Wallow, GLOBALFOUNDRIES, Inc. (United States)


Published in SPIE Proceedings Vol. 7985:
27th European Mask and Lithography Conference
Uwe F.W. Behringer, Editor(s)

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