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Proceedings Paper

Intelligent seismic sensor with double three component MEMS accelerometers
Author(s): Jihua Fu; Jianjun Wang; Zhitao Li; Xiaoxi Liu; Zhongyu Wang
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Paper Abstract

To better understand the response and damage characteristics of structures under earthquakes, a great number of intelligent seismic sensors with high performance were needed to be installed distributed in the whole country. The intelligent seismic sensor was a cost-sensitive application because of its large number of usages. For this reason, a low cost intelligent seismic sensor was put forward in this paper. This kind of intelligent seismic sensor cut down the cost without sacrificing performance by introducing two three component MEMS accelerometers. It was composed by a microprocessor, two three component MEMS accelerometers, an A/D converter, a flash memory, etc. The MEMS accelerometer has better structure and frequency response characteristics than the conventional geophones'. But one MEMS accelerometer tended to be unreliable and have no enough dynamic range for precision measurement. Therefore two three component MEMS accelerometers were symmetrically mounted on both sides of the circuit board. And their measuring values were composed to describe the ground motion or structure response. The composed value was the in-phase stacking of the two accelerometers' measuring values, which enhanced the signal noise ratio of the sensor and broadened its dynamic range. Through the preliminary theory and experiment analysis, the low cost intelligent seismic sensor could measure the acceleration in accuracy.

Paper Details

Date Published: 28 December 2010
PDF: 6 pages
Proc. SPIE 7544, Sixth International Symposium on Precision Engineering Measurements and Instrumentation, 754422 (28 December 2010); doi: 10.1117/12.885322
Show Author Affiliations
Jihua Fu, Institute of Crustal Dynamics (China)
Jianjun Wang, Institute of Crustal Dynamics (China)
Zhitao Li, Institute of Crustal Dynamics (China)
Xiaoxi Liu, Institute of Crustal Dynamics (China)
Zhongyu Wang, Beihang Univ. (China)


Published in SPIE Proceedings Vol. 7544:
Sixth International Symposium on Precision Engineering Measurements and Instrumentation

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