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Proceedings Paper

Pixel level packaging for uncooled IRFPA
Author(s): G. Dumont; W. Rabaud; X. Baillin; JL. Pornin; L. Carle; V. Goudon; C. Vialle; M. Pellat; A. Arnaud
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Paper Abstract

As packaging represents a significant part of uncooled IR detectors price, a collective packaging process would contribute to enlarge uncooled IRFPA application to very low cost camera market. Since the first proof of the pixel level packaging for uncooled IRFPA in 2008, CEA-LETI is still strongly involved in the development of an innovative packaging technology. This one aims at encapsulating each pixel under vacuum in the direct continuity of the bolometer process. Moreover, a thin film getter has been developed to be integrated in the micropackaging so as to increase the packaging lifespan. This paper presents the recent development at CEA-LETI of this pixel level packaging technology including getter integration and vacuum level measurements.

Paper Details

Date Published: 20 May 2011
PDF: 7 pages
Proc. SPIE 8012, Infrared Technology and Applications XXXVII, 80121I (20 May 2011); doi: 10.1117/12.883852
Show Author Affiliations
G. Dumont, CEA-LETI-MINATEC (France)
W. Rabaud, CEA-LETI-MINATEC (France)
X. Baillin, CEA-LETI-MINATEC (France)
JL. Pornin, CEA-LETI-MINATEC (France)
L. Carle, CEA-LETI-MINATEC (France)
V. Goudon, CEA-LETI-MINATEC (France)
C. Vialle, CEA-LETI-MINATEC (France)
M. Pellat, CEA-LETI-MINATEC (France)
A. Arnaud, CEA-LETI-MINATEC (France)


Published in SPIE Proceedings Vol. 8012:
Infrared Technology and Applications XXXVII
Bjørn F. Andresen; Gabor F. Fulop; Paul R. Norton, Editor(s)

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