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Proceedings Paper

Fundamental investigation of negative tone development (NTD) for the 22nm node (and beyond)
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Paper Abstract

In this work, we investigate the Negative Tone Develop (NTD) process from a fundamental materials/process interaction perspective. Several key differences exist between a negative tone develop process and a traditional positive tone develop system. For example, the organic solvent dissolves the unexposed material, while the deprotected resist remains intact. This causes key differences in key patterning properties, such as pattern collapse, adhesion, remaining resist, and photoresist etch selectivity. We have carried out fundamental studies to understand these new interactions between developer and remaining resist with negative tone develop systems. We have characterized the dynamic dissolution behavior of a model system with a quartz crystal microbalance with both positive and negative tone solvent developers. We have also compared contrast curves, and a fundamental model of image collapse. In addition, we present first results on Optical Proximity Correction (OPC) modeling results of current Negative Tone Develop (NTD) resist/developer systems.

Paper Details

Date Published: 16 April 2011
PDF: 12 pages
Proc. SPIE 7972, Advances in Resist Materials and Processing Technology XXVIII, 797206 (16 April 2011); doi: 10.1117/12.882843
Show Author Affiliations
Guillaume Landie, STMicroelectronics (United States)
Yongan Xu, IBM Corp. (United States)
Sean Burns, IBM Corp. (United States)
Kenji Yoshimoto, IBM Thomas J. Watson Research Ctr. (United States)
Martin Burkhardt, IBM Corp. (United States)
Larry Zhuang, IBM Corp. (United States)
Karen Petrillo, IBM Corp. (United States)
Jason Meiring, IBM Corp. (United States)
Dario Goldfarb, IBM Thomas J. Watson Research Ctr. (United States)
Martin Glodde, IBM Thomas J. Watson Research Ctr. (United States)
Anthony Scaduto, IBM Corp. (United States)
Matthew Colburn, IBM Corp. (United States)
Jason Desisto, The Dow Chemical Co. (United States)
Young Bae, The Dow Chemical Co. (United States)
Michael Reilly, The Dow Chemical Co. (United States)
Cecily Andes, The Dow Chemical Co. (United States)
Vaishali Vohra, The Dow Chemical Co. (United States)


Published in SPIE Proceedings Vol. 7972:
Advances in Resist Materials and Processing Technology XXVIII
Robert D. Allen; Mark H. Somervell, Editor(s)

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