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Proceedings Paper

New advances with REBL for maskless high-throughput EBDW lithography
Author(s): Paul Petric; Chris Bevis; Mark McCord; Allen Carroll; Alan Brodie; Upendra Ummethala; Luca Grella; Anthony Cheung; Regina Freed
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Paper Abstract

REBL (Reflective Electron Beam Lithography) is a program for the development of a novel approach for highthroughput maskless lithography. The program at KLA-Tencor is funded under the DARPA Maskless Nanowriter Program. A DPG (digital pattern generator) chip containing over 1 million reflective pixels that can be individually turned on or off is used to project an electron beam pattern onto the wafer. The DARPA program is targeting 5 to 7 wafers per hour at the 45 nm node, and this paper will describe improvements to both increase the throughput as well as extend the system to the 2x nm node and beyond. This paper focuses on three specific areas of REBL technology. First, a new column design has been developed based on a Wien filter to separate the illumination and projection beams. The new column design is much smaller, and has better performance both in resolution and throughput than the first column which used a magnetic prism for separation. This new column design is the first step leading to a multiple column system. Second, the rotary stage latest results of a fully integrated DPG CMOS chip with lenslets will be reviewed. An array of over 1 million micro lenses which is fabricated on top of the CMOS DPG chip has been developed. The microlens array eliminates crosstalk between adjacent pixels, maximizes contrast between on and off states, and provides matching of the NA between the DPG reflector and the projection optics.

Paper Details

Date Published: 4 April 2011
PDF: 14 pages
Proc. SPIE 7970, Alternative Lithographic Technologies III, 797018 (4 April 2011); doi: 10.1117/12.882636
Show Author Affiliations
Paul Petric, KLA-Tencor Corp. (United States)
Chris Bevis, KLA-Tencor Corp. (United States)
Mark McCord, KLA-Tencor Corp. (United States)
Allen Carroll, KLA-Tencor Corp. (United States)
Alan Brodie, KLA-Tencor Corp. (United States)
Upendra Ummethala, KLA-Tencor Corp. (United States)
Luca Grella, KLA-Tencor Corp. (United States)
Anthony Cheung, KLA-Tencor Corp. (United States)
Regina Freed, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 7970:
Alternative Lithographic Technologies III
Daniel J. C. Herr, Editor(s)

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