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Proceedings Paper

3D heterogeneous integration of wireless communicating nano-sensors on flexible substrate
Author(s): M. M. Jatlaoui; D. Dragomirescu; S. Charlot; P. Pons; H. Aubert; R. Plana
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Paper Abstract

In this communication, the 3D heterogeneous integration of miniaturized communicating modules used for wireless network application is described. These communicating objects present the particularity of being in Nano-scale range. In fact, each object is composed of Nano-sensors, transceivers and E/R antenna. Such investigated ways of Nano-system integration will allow the development of sensor communicating modules which can be inserted and located in areas with access difficulty (in particular in non planar area) or even in inaccessible places. This attractive integration concept is discussed and illustrated here.

Paper Details

Date Published: 7 December 2010
PDF: 7 pages
Proc. SPIE 7821, Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies V, 78211E (7 December 2010); doi: 10.1117/12.882308
Show Author Affiliations
M. M. Jatlaoui, Lab. d'Analyse et d'Architecture des Systèmes, CNRS (France)
Univ. of Toulouse (France)
D. Dragomirescu, Lab. d'Analyse et d'Architecture des Systèmes, CNRS (France)
Univ. of Toulouse (France)
S. Charlot, Lab. d'Analyse et d'Architecture des Systèmes, CNRS (France)
Univ. of Toulouse (France)
P. Pons, Lab. d'Analyse et d'Architecture des Systèmes, CNRS (France)
Univ. of Toulouse (France)
H. Aubert, Lab. d'Analyse et d'Architecture des Systèmes, CNRS (France)
Univ. of Toulouse (France)
R. Plana, Lab. d'Analyse et d'Architecture des Systèmes, CNRS (France)
Univ. of Toulouse (France)


Published in SPIE Proceedings Vol. 7821:
Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies V

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