Share Email Print

Proceedings Paper

Enhanced thermal conductivity of novel multifunctional polyphenylene sulfide composites embedded with heat transfer networks of hybrid fillers
Author(s): Siu N. Leung; Omer M. Khan; Ellen Chan; Hani E. Naguib; Francis Dawson; Vincent Adinkrah; Laszlo Lakatos-Hayward
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Today's smaller, more powerful electronic devices, communications equipment, and lighting apparatus required optimum heat dissipation solutions. Traditionally, metals are widely known for their superior thermal conductivity; however, their good electrical conductivity has limited their applications in heat management components for microelectronic applications. This prompts the requirement to develop novel plastic composites that satisfy multifunctional requirements thermally, electrically, and mechanically. Furthermore, the moldability of polymer composites would make them ideal for manufacturing three-dimensional, net-shape enclosures and/or heat management assembly. Using polyphenylene sulfide (PPS) as the matrix, heat transfer networks were developed and structured by embedding hexagonal boron nitride (BN) alone, blending BN fillers of different shapes and sizes, as well as hybridizing BN fillers with carbonaceous nano- and micro-fillers. Parametric studies were conducted to elucidate the effects of types, shapes, sizes, and hybridization of fillers on the composite's thermal and electrical properties. The use of hybrid fillers, with optimized material formulations, was found to effectively promote a composite's thermal conductivity. This was achieved by optimizing the development of an interconnected thermal conductive network through structuring hybrid fillers with appropriate shapes and sizes. The thermal conductive composite affords unique opportunities to injection mold three-dimensional, net-shape microelectronic enclosures with superior heat dissipation performance.

Paper Details

Date Published: 28 April 2011
PDF: 10 pages
Proc. SPIE 7978, Behavior and Mechanics of Multifunctional Materials and Composites 2011, 79780V (28 April 2011); doi: 10.1117/12.881896
Show Author Affiliations
Siu N. Leung, Univ. of Toronto (Canada)
Omer M. Khan, Univ. of Toronto (Canada)
Ellen Chan, Univ. of Toronto (Canada)
Hani E. Naguib, Univ. of Toronto (Canada)
Francis Dawson, Univ. of Toronto (Canada)
Vincent Adinkrah, AEG Power Solutions (Canada)
Laszlo Lakatos-Hayward, AEG Power Solutions (Canada)

Published in SPIE Proceedings Vol. 7978:
Behavior and Mechanics of Multifunctional Materials and Composites 2011
Zoubeida Ounaies; Stefan S. Seelecke, Editor(s)

© SPIE. Terms of Use
Back to Top