Share Email Print
cover

Proceedings Paper

Development of micro-pump for bio-MEMS by using new bio-compatible piezoelectric material MgSiO3
Author(s): Noriaki Okamoto; Hwisim Hwang; Yusuke Morita; Eiji Nakamachi
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

In this study, a micro-pump for Bio-MEMS by using a new bio-compatible piezoelectric thin film is newly developed, which could be built in DDS and HMS. At first, we carried out the performance assessment of our piezoelectric thin film pump of a newly designed micro-fluid system by using the finite element method, which can consider the interaction between the piezoelectric solid and the fluid. The results of numerical analyses show a enough transportation ability of our micro-pump system. Then, we generate multilayer MgSiO3 thin film on Cu/Ti/Si(100) substrate by using RFmagnetron sputtering method. We measured the crystallographic orientation and piezoelectric property and confirmed that MgSiO3(101) crystal has grown well. The strain constant d33 was calculated by using the displacement-voltage curve, such as 179.4pm/V. Further, the deflection and frequency of the monomorph-actuator, which fabricated by using the micro-machining process, were measured by the laser doppler vibrometer. It showed that the deflection linearly increased with applied voltage, and it was 82.6nm with the applied voltage of 15V. We evaluated the flow rate of micropump using the luminance difference measurement method. The results showed that the maximum flow rate was 7.1nl/s at the applied voltage of 15V. It shows the possibility of Bio-MEMS device by using our newly developed micro-pump with a new bio-compatible piezoelectric material MgSiO3.

Paper Details

Date Published: 18 April 2011
PDF: 10 pages
Proc. SPIE 7981, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2011, 798152 (18 April 2011); doi: 10.1117/12.881760
Show Author Affiliations
Noriaki Okamoto, Doshisha Univ. (Japan)
Hwisim Hwang, Doshisha Univ. (Japan)
Yusuke Morita, Doshisha Univ. (Japan)
Eiji Nakamachi, Doshisha Univ. (Japan)


Published in SPIE Proceedings Vol. 7981:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2011
Masayoshi Tomizuka, Editor(s)

© SPIE. Terms of Use
Back to Top