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Proceedings Paper

Resist freezing process challenges of cross pattern applications
Author(s): Zishu Zhang; Kaveri Jain; Scott L. Light; Anton J. deVilliers
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Paper Abstract

Three resist freezing methods (fluoride plasma, chemical and thermal freezing) were studied for double patterning cross pattern by printing the second layer directly on top of the first resist layer. Different methods show different challenges: plasma freezing is very hard to remove footing on both layers; Chemical freezing first layer CD will grow after completion of second pattern; thermal freezing will change line curvature when the CD is smaller than 50nm, if first layer is wave type pattern.

Paper Details

Date Published: 15 April 2011
PDF: 7 pages
Proc. SPIE 7972, Advances in Resist Materials and Processing Technology XXVIII, 79720E (15 April 2011); doi: 10.1117/12.881552
Show Author Affiliations
Zishu Zhang, Micron Technology, Inc. (United States)
Kaveri Jain, Micron Technology, Inc. (United States)
Scott L. Light, Micron Technology, Inc. (United States)
Anton J. deVilliers, Micron Technology, Inc. (United States)


Published in SPIE Proceedings Vol. 7972:
Advances in Resist Materials and Processing Technology XXVIII
Robert D. Allen; Mark H. Somervell, Editor(s)

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