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Proceedings Paper

Electron beam induced freezing of positive tone, EUV resists for directed self assembly applications
Author(s): Han-Hao Cheng; Imelda Keen; Anguang Yu; Ya-Mi Chuang; Idriss Blakey; Kevin S. Jack; Michael J. Leeson; Todd R. Younkin; Andrew K. Whittaker
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Paper Abstract

The commercialization of 32 nm lithography has been made possible by using double patterning, a technique that allows for an increased pattern density, potentially, through resist freezing and high precision pattern registration. Recent developments in directed self assembly (DSA) also uses resist freezing for stabilizing positive tone resists used in graphoepitaxy. We have developed a method of patterning an open source, positive tone EUV resist using electron beam lithography (EBL), and studied a novel way of freezing a positive tone EUV photoresists through electron beam induced crosslinking. Through metrological analysis, crosslinked pattern was observed to retain consistent critical dimensions (CD) and line-edge roughness (LER) after they were annealed at temperatures higher than the glass transition of the photoresist. This process has been used to freeze patterned EUV photoresists, which have been subsequently used for directed self assembly of PS-b-PMMA and has potential applications in double patterning in an LFLE scenario.

Paper Details

Date Published: 4 April 2011
PDF: 9 pages
Proc. SPIE 7970, Alternative Lithographic Technologies III, 79701V (4 April 2011); doi: 10.1117/12.881491
Show Author Affiliations
Han-Hao Cheng, The Univ. of Queensland (Australia)
Imelda Keen, The Univ. of Queensland (Australia)
Anguang Yu, The Univ. of Queensland (Australia)
Ya-Mi Chuang, The Univ. of Queensland (Australia)
Idriss Blakey, The Univ. of Queensland (Australia)
Kevin S. Jack, The Univ. of Queensland (Australia)
Michael J. Leeson, Intel Corp. (United States)
Todd R. Younkin, Intel Corp. (United States)
Andrew K. Whittaker, The Univ. of Queensland (Australia)


Published in SPIE Proceedings Vol. 7970:
Alternative Lithographic Technologies III
Daniel J. C. Herr, Editor(s)

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