Share Email Print
cover

Proceedings Paper

Optimization of pitch-split double patterning photoresist for applications at the 16nm node
Author(s): Steven J. Holmes; Cherry Tang; Sean Burns; Yunpeng Yin; Rex Chen; Chiew-seng Koay; Sumanth Kini; Hideyuki Tomizawa; Shyng-Tsong Chen; Nicolette Fender; Brian Osborn; Lovejeet Singh; Karen Petrillo; Guillaume Landie; Scott Halle; Sen Liu; John C. Arnold; Terry Spooner; Rao Varanasi; Mark Slezak; Matthew Colburn
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Pitch-split resist materials have been developed for the fabrication of sub-74 nm pitch semiconductor devices. A thermal cure method is used to enable patterning of a second layer of resist over the initially formed layer. Process window, critical dimension uniformity, defectivity and integration with fabricator applications have been explored. A tone inversion process has been developed to enable the application of pitch split to dark field applications in addition to standard bright field applications.

Paper Details

Date Published: 16 April 2011
PDF: 14 pages
Proc. SPIE 7972, Advances in Resist Materials and Processing Technology XXVIII, 79720G (16 April 2011); doi: 10.1117/12.881489
Show Author Affiliations
Steven J. Holmes, IBM Systems and Technology Group (United States)
Cherry Tang, JSR Micro, Inc. (United States)
Sean Burns, IBM Research Div. (United States)
Yunpeng Yin, IBM Systems and Technology Group (United States)
Rex Chen, IBM Systems and Technology Group (United States)
Chiew-seng Koay, IBM Systems and Technology Group (United States)
Sumanth Kini, KLA-Tencor Corp. (United States)
Hideyuki Tomizawa, Toshiba (United States)
Shyng-Tsong Chen, IBM Systems and Technology Group (United States)
Nicolette Fender, JSR Micro, Inc. (United States)
Brian Osborn, JSR Micro, Inc. (United States)
Lovejeet Singh, JSR Micro, Inc. (United States)
Karen Petrillo, IBM Systems and Technology Group (United States)
Guillaume Landie, IBM Systems and Technology Group (United States)
Scott Halle, IBM Systems and Technology Group (United States)
Sen Liu, KLA-Tencor Corp. (United States)
John C. Arnold, IBM Research Div. (United States)
Terry Spooner, IBM Research Div. (United States)
Rao Varanasi, IBM Systems and Technology Group (United States)
Mark Slezak, JSR Micro, Inc. (United States)
Matthew Colburn, IBM Research Div. (United States)


Published in SPIE Proceedings Vol. 7972:
Advances in Resist Materials and Processing Technology XXVIII
Robert D. Allen; Mark H. Somervell, Editor(s)

© SPIE. Terms of Use
Back to Top