Share Email Print
cover

Proceedings Paper

Validation of process cost effective layout refinement utilizing design intent
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Continuous shrinkage of design rule (DR) in ultra-large-scale integrated circuit (ULSI) devices brings about greater difficulty in the manufacturing process. The keys to meeting small process margin are adequate extraction of critical dimension (CD) tolerance for each object and budgeting the tolerance for each process step. Furthermore, to extract adequate tolerance, design intent in terms of electrical behavior should be carefully considered. Electrical behavior is carefully verified in design stages using various electronic design automation (EDA) tools. However, once the design data is converted to layout data and signed off, most of the design intent is abandoned and unrecognized in the process stage. Thus, instead of essential tolerance assignment according to layout-related design intent, uniform and redundant tolerance is used, and so excess tolerance is assigned for some layouts. To solve the problem described above, a tolerance-based manufacturing system utilizing flexible layout-dependent speculation derived from design intent has been discussed. In this paper, test flow utilizing design intent is developed. In the flow, electrical small-margin spots are extracted, verified with customized criteria according to the tolerance derived from design intent, and fixed in the process. The proposed flow is examined and validated for the application to 40nm node test chip.

Paper Details

Date Published: 4 April 2011
PDF: 8 pages
Proc. SPIE 7974, Design for Manufacturability through Design-Process Integration V, 79740G (4 April 2011); doi: 10.1117/12.881485
Show Author Affiliations
Sachiko Kobayashi, Toshiba Corp. (Japan)
Atsuhiko Ikeuchi, Toshiba Corp. Semiconductor Co. (Japan)
Kazunari Kimura, Toshiba Corp. Semiconductor Co. (Japan)
Toshiya Kotani, Toshiba Corp. (Japan)
Satoshi Tanaka, Toshiba Corp. (Japan)
Suigen Kyoh, Toshiba Corp. (Japan)
Shimon Maeda, Toshiba Corp. (Japan)
Soichi Inoue, Toshiba Corp. (Japan)


Published in SPIE Proceedings Vol. 7974:
Design for Manufacturability through Design-Process Integration V
Michael L. Rieger, Editor(s)

© SPIE. Terms of Use
Back to Top