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Proceedings Paper

Tool-to-tool matching issues due to photoresist shrinkage effects
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Paper Abstract

Photoresist shrinkage is an important systematic uncertainty source in critical dimension-scanning electron microscope (CD-SEM) metrology of lithographic features. In terms of metrology gauge metrics, it influences both the precision and the accuracy of CD-SEM measurements, while locally damaging the sample. Minimization or elimination of shrinkage is desirable, yet elusive. Because this error source will furthermore be a factor in CD-SEM metrology on polymer materials, learning to work around this issue is necessary. Tool-to-tool matching is another important component of measurement uncertainty that metrologists must control in high volume manufacturing, and photoresist samples are a most difficult case due to shrinkage effects, as tool-to-tool biases can vary based on the sample or other parameters. In this work, we explore different shrinkage effects and their influence on matching. This will include an investigation of how the photoresist shrinkage rate varies with time from the chemical development of the photoresists, which necessitates that measurements on different tools within a group be performed in rapid succession to avoid additional error. The differences in shrinkage rates between static and dynamic load/unload cases will also be addressed, as these effects also influence matching. The results of these dynamic effect experiments will be shown to have far-reaching implications for the shrinkage phenomenon in general. Finally, various sampling schemes for matching will be explored, through both simulation and experiment, for use with shrinking materials. Included is a method whereby various fleet tools measure different locations, once per tool, within a uniform line/space grating. Finally, we will assess how well matching can be achieved using these techniques.

Paper Details

Date Published: 20 April 2011
PDF: 17 pages
Proc. SPIE 7971, Metrology, Inspection, and Process Control for Microlithography XXV, 79710B (20 April 2011); doi: 10.1117/12.881400
Show Author Affiliations
Benjamin Bunday, SEMATECH (United States)
Aaron Cordes, SEMATECH (United States)
Carsten Hartig, GLOBALFOUNDRIES Inc. (Germany)
John Allgair, GLOBALFOUNDRIES Inc. (Germany)
Alok Vaid, GLOBALFOUNDRIES Inc. (United States)
Eric Solecky, IBM Microelectronics (United States)
Narender Rana, IBM Microelectronics (United States)


Published in SPIE Proceedings Vol. 7971:
Metrology, Inspection, and Process Control for Microlithography XXV
Christopher J. Raymond, Editor(s)

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