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Proceedings Paper

High-density patterned media fabrication using jet and flash imprint lithography
Author(s): Zhengmao Ye; Rick Ramos; Cynthia Brooks; Logan Simpson; John Fretwell; Scott Carden; Paul Hellebrekers; Dwayne LaBrake; Douglas J. Resnick; S. V. Sreenivasan
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Paper Abstract

The Jet and Flash Imprint Lithography (J-FIL®) process uses drop dispensing of UV curable resists for high resolution patterning. Several applications, including patterned media, are better, and more economically served by a full substrate patterning process since the alignment requirements are minimal. Patterned media is particularly challenging because of the aggressive feature sizes necessary to achieve storage densities required for manufacturing beyond the current technology of perpendicular recording. In this paper, the key process steps for the application of J-FIL to pattern media fabrication are reviewed with special attention to substrate cleaning, vapor adhesion of the adhesion layer and imprint performance at >300 disk per hour. Also discussed are recent results for imprinting discrete track patterns at half pitches of 24nm and bit patterned media patterns at densities of 1 Tb/in2.

Paper Details

Date Published: 2 April 2011
PDF: 9 pages
Proc. SPIE 7970, Alternative Lithographic Technologies III, 79700L (2 April 2011); doi: 10.1117/12.879932
Show Author Affiliations
Zhengmao Ye, Molecular Imprints, Inc. (United States)
Rick Ramos, Molecular Imprints, Inc. (United States)
Cynthia Brooks, Molecular Imprints, Inc. (United States)
Logan Simpson, Molecular Imprints, Inc. (United States)
John Fretwell, Molecular Imprints, Inc. (United States)
Scott Carden, Molecular Imprints, Inc. (United States)
Paul Hellebrekers, Molecular Imprints, Inc. (United States)
Dwayne LaBrake, Molecular Imprints, Inc. (United States)
Douglas J. Resnick, Molecular Imprints, Inc. (United States)
S. V. Sreenivasan, Molecular Imprints, Inc. (United States)


Published in SPIE Proceedings Vol. 7970:
Alternative Lithographic Technologies III
Daniel J. C. Herr, Editor(s)

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