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Proceedings Paper

High-throughput critical dimensions uniformity (CDU) measurement of two-dimensional (2D) structures using scanning electron microscope (SEM) systems
Author(s): Jennifer Fullam; Carol Boye; Theodorus Standaert; John Gaudiello; Derek Tomlinson; Hong Xiao; Wei Fang; Xu Zhang; Fei Wang; Long Ma; Yan Zhao; Jack Jau
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Paper Abstract

In this paper, we tested a novel methodology of measuring critical dimension (CD) uniformity, or CDU, with electron beam (e-beam) hotspot inspection and measurement systems developed by Hermes Microvision, Inc. (HMI). The systems were used to take images of two-dimensional (2D) array patterns and measure CDU values in a custom designated fashion. Because this methodology combined imaging of scanning micro scope (SEM) and CD value averaging over a large array pattern of optical CD, or OCD, it can measure CDU of 2D arrays with high accuracy, high repeatability and high throughput.

Paper Details

Date Published: 28 April 2011
PDF: 11 pages
Proc. SPIE 7971, Metrology, Inspection, and Process Control for Microlithography XXV, 79710Y (28 April 2011); doi: 10.1117/12.879910
Show Author Affiliations
Jennifer Fullam, IBM Corp. (United States)
Carol Boye, IBM Corp. (United States)
Theodorus Standaert, IBM Corp. (United States)
John Gaudiello, IBM Corp. (United States)
Derek Tomlinson, TM2C (United States)
Hong Xiao, Hermes-Microvision, Inc. (United States)
Wei Fang, Hermes-Microvision, Inc. (United States)
Xu Zhang, Hermes-Microvision, Inc. (United States)
Fei Wang, Hermes-Microvision, Inc. (United States)
Long Ma, Hermes-Microvision, Inc. (United States)
Yan Zhao, Hermes-Microvision, Inc. (United States)
Jack Jau, Hermes-Microvision, Inc. (United States)


Published in SPIE Proceedings Vol. 7971:
Metrology, Inspection, and Process Control for Microlithography XXV
Christopher J. Raymond, Editor(s)

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