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Proceedings Paper

Thickness variation study of RFID-based folded patch antennas for strain sensing
Author(s): Xiaohua Yi; Terence Wu; Gabriel Lantz; Yang Wang; Roberto T. Leon; Manos M. Tentzeris
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Paper Abstract

This paper explores folded patch antennas for the development of low-cost and wireless smart-skin sensors that monitor the strain in metallic structures. When the patch antenna is under strain/deformation, its resonance frequency varies accordingly. The variation can be easily interrogated and recorded by a wireless reader that also provides power for the antenna operation. The patch antenna adopts a specially selected substrate material with low dielectric constant, as well as an inexpensive off-the-shelf radiofrequency identification (RFID) chip for signal modulation. A thicker substrate increases RFID signal-to-noise ratio, but reduces the strain transfer efficiency. To experimentally study the effect of substrate thickness, two prototype folded patch antennas with different substrate thicknesses have been designed and manufactured. For both prototypes, tensile testing results show strong linearity between the interrogated resonance frequency and the strain experienced by the antenna. Longer interrogation range is achieved with the larger substrate thickness.

Paper Details

Date Published: 14 April 2011
PDF: 11 pages
Proc. SPIE 7981, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2011, 79811H (14 April 2011); doi: 10.1117/12.879868
Show Author Affiliations
Xiaohua Yi, Georgia Institute of Technology (United States)
Terence Wu, Georgia Institute of Technology (United States)
Gabriel Lantz, Georgia Institute of Technology (United States)
Yang Wang, Georgia Institute of Technology (United States)
Roberto T. Leon, Georgia Institute of Technology (United States)
Manos M. Tentzeris, Georgia Institute of Technology (United States)


Published in SPIE Proceedings Vol. 7981:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2011
Masayoshi Tomizuka, Editor(s)

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