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Proceedings Paper

Beam shaping: top hat and customized intensity distributions for semiconductor manufacturing and inspection
Author(s): Ansgar Teipel; Lutz Aschke
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Paper Abstract

Enabling the next technology nodes with optical technologies means further reduced error budgets for optical systems and new optical approaches for higher precision and increased throughput. This contribution discusses important aspects and features of laser beam shaping in optical systems for semiconductor manufacturing and inspection. Beam shaping principles for different types of lasers and illumination requirements are explained.

Paper Details

Date Published: 22 March 2011
PDF: 15 pages
Proc. SPIE 7973, Optical Microlithography XXIV, 797321 (22 March 2011); doi: 10.1117/12.879640
Show Author Affiliations
Ansgar Teipel, LIMO Lissotschenko Mikrooptik GmbH (Germany)
Lutz Aschke, LIMO Lissotschenko Mikrooptik GmbH (Germany)

Published in SPIE Proceedings Vol. 7973:
Optical Microlithography XXIV
Mircea V. Dusa, Editor(s)

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