Share Email Print

Proceedings Paper

High-sensitivity EUV resists based on fluorinated polymers
Author(s): Tsuneo Yamashita; Masamichi Morita; Yoshito Tanaka; Julius Joseph Santillan; Toshiro Itani
Format Member Price Non-Member Price
PDF $17.00 $21.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

There is a growing interest in the fluorinization of resist materials in improving pattern formation efficiency for extreme ultraviolet (EUV) lithography. The increased polymer absorption coefficient obtained through this resist platform is expected to enhance acid production and in effect improve pattern formation efficiency. Our work over the past several years has shown that the main-chain fluorinated base resins realized by the co-polymerization of tetrafluoroethylene (TFE) and norbornene derivatives offer high dissolution rates. Based on this, a EUV resist which was prepared using the by the fluorinated polymers was investigated. Imaging evaluations, using the small field exposure tool (SFET by Canon / EUVA) with annular (σouter 0.7 / σinner 0.3) illumination conditions were performed. Relatively high sensitivity of 6.3mJ•cm-2 for half-pitch (hp) 45nm and satisfactory resolution limit of hp 40nm was achieved. At present, line width roughness (LWR) was measured at comparatively large values of more than 8.4nm at hp 45nm. This shows that further material and process optimizations may be necessary to improve its present lithographic capability. However, these initial results have shown the potential of fluorinated-polymer based platform as a possible solution for high sensitivity, high resolution and low LWR EUV resists. In this paper, we report recent results of high sensitivity of 5.1mJ•cm-2 for half-pitch (hp) 40nm, optimization of protecting groups and photo acid generators

Paper Details

Date Published: 15 April 2011
PDF: 13 pages
Proc. SPIE 7972, Advances in Resist Materials and Processing Technology XXVIII, 79721G (15 April 2011); doi: 10.1117/12.879568
Show Author Affiliations
Tsuneo Yamashita, Daikin Industries, Ltd. (Japan)
Masamichi Morita, Daikin Industries, Ltd. (Japan)
Yoshito Tanaka, Daikin Industries, Ltd. (Japan)
Julius Joseph Santillan, Semiconductor Leading Edge Technologies, Inc. (Japan)
Toshiro Itani, Semiconductor Leading Edge Technologies, Inc. (Japan)

Published in SPIE Proceedings Vol. 7972:
Advances in Resist Materials and Processing Technology XXVIII
Robert D. Allen; Mark H. Somervell, Editor(s)

© SPIE. Terms of Use
Back to Top