Share Email Print
cover

Proceedings Paper

Evaluation results of a new EUV reticle pod having reticle grounding paths
Author(s): Kazuya Ota; Masami Yonekawa; Mitsuaki Amemiya; Takao Taguchi; Osamu Suga
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

A new SEMI standard E152-0709 "Mechanical Specification of EUV Pod for 150 mm EUVL Reticles" has been published in July 2009. In the standard, reticle grounding requirements are mentioned as related information: an electrical connection between the front and back sides of EUVL reticles as well as the electrical connection to the reticle backside from outside the outer pod may be needed and specified in future. Reticle grounding is very important for reticle protection not only from electrostatic discharge (ESD) damage but also from particle contamination due to electrostatic attraction (ESA). Many past data suggested that EUV masks have to be grounded during shipping, storage and tool handling to prevent particle adhesion. Canon, Nikon and Entegris have jointly developed a new ESD-free EUV pod "cnPod-ESD" which has electrical connections to the reticle from outside the outer pod by modifying a SEMI compliant EUV pod "cnPod". In order to have an electrical connection between the reticle backside and the outer pod, a cantilever is installed inside the inner pod cover. The cantilever touches the reticle backside just inside 146mm x 146mm which is specified as the minimum conductive layer area in SEMI P37 "Specification for Extreme Ultraviolet Lithography Substrates and Blanks". In order to have an electrical connection between the reticle frontside and the outer pod, though it is not required in E152, an electrical conductive material is used for the reticle supports on the inner pod baseplate. We will show various evaluation data of the new ESD-free pods from particle contamination point of view and will discuss the necessity of the reticle grounding in this paper. We will also mention the necessity of modification of the SEMI standard P37 to make a universal EUV ESD-free pod.

Paper Details

Date Published: 8 April 2011
PDF: 8 pages
Proc. SPIE 7969, Extreme Ultraviolet (EUV) Lithography II, 79691V (8 April 2011); doi: 10.1117/12.879553
Show Author Affiliations
Kazuya Ota, Semiconductor Leading Edge Technologies, Inc. (Japan)
Masami Yonekawa, Semiconductor Leading Edge Technologies, Inc. (Japan)
Mitsuaki Amemiya, Semiconductor Leading Edge Technologies, Inc. (Japan)
Takao Taguchi, Semiconductor Leading Edge Technologies, Inc. (Japan)
Osamu Suga, Semiconductor Leading Edge Technologies, Inc. (Japan)


Published in SPIE Proceedings Vol. 7969:
Extreme Ultraviolet (EUV) Lithography II
Bruno M. La Fontaine; Patrick P. Naulleau, Editor(s)

© SPIE. Terms of Use
Back to Top