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Proceedings Paper

Methodology for balancing design and process tradeoffs for deep-subwavelength technologies
Author(s): Ioana Graur; Tina Wagner; Deborah Ryan; Dureseti Chidambarrao; Anand Kumaraswamy; Jeanne Bickford; Mark Styduhar; Lee Wang
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Paper Abstract

For process development of deep-subwavelength technologies, it has become accepted practice to use model-based simulation to predict systematic and parametric failures. Increasingly, these techniques are being used by designers to ensure layout manufacturability, as an alternative to, or complement to, restrictive design rules. The benefit of model-based simulation tools in the design environment is that manufacturability problems are addressed in a design-aware way by making appropriate trade-offs, e.g., between overall chip density and manufacturing cost and yield. The paper shows how library elements and the full ASIC design flow benefit from eliminating hot spots and improving design robustness early in the design cycle. It demonstrates a path to yield optimization and first time right designs implemented in leading edge technologies. The approach described herein identifies those areas in the design that could benefit from being fixed early, leading to design updates and avoiding later design churn by careful selection of design sensitivities. This paper shows how to achieve this goal by using simulation tools incorporating various models from sparse to rigorously physical, pattern detection and pattern matching, checking and validating failure thresholds.

Paper Details

Date Published: 4 April 2011
PDF: 15 pages
Proc. SPIE 7974, Design for Manufacturability through Design-Process Integration V, 79740C (4 April 2011); doi: 10.1117/12.879537
Show Author Affiliations
Ioana Graur, IBM Corp. (United States)
Tina Wagner, IBM Corp. (United States)
Deborah Ryan, IBM Corp. (United States)
Dureseti Chidambarrao, IBM Corp. (United States)
Anand Kumaraswamy, IBM Corp. (India)
Jeanne Bickford, IBM Corp. (United States)
Mark Styduhar, IBM Corp. (United States)
Lee Wang, IBM Corp. (United States)


Published in SPIE Proceedings Vol. 7974:
Design for Manufacturability through Design-Process Integration V
Michael L. Rieger, Editor(s)

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