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Proceedings Paper

Overlay improvement roadmap: strategies for scanner control and product disposition for 5-nm overlay
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Paper Abstract

To keep pace with the overall dimensional shrink in the industry, overlay capability must also shrink proportionally. Unsurprisingly, overlay capability < 10 nm is already required for currently nodes in development, and the need for multi-patterned levels has accelerated the overlay roadmap requirements to the order of 5 nm. To achieve this, many improvements need to be implemented in all aspects of overlay measurement, control, and disposition. Given this difficult task, even improvements involving fractions of a nanometer need to be considered. These contributors can be divided into 5 categories: scanner, process, reticle, metrology, and APC. In terms of overlay metrology, the purpose is two-fold: To measure what the actual overlay error is on wafer, and to provide appropriate APC feedback to reduce overlay error for future incoming hardware. We show that with optimized field selection plan, as well as appropriate within-field sampling, both objectives can be met. For metrology field selection, an optimization algorithm has been employed to proportionately sample fields of different scan direction, as well as proportional spatial placement. In addition, intrafield sampling has been chosen to accurately represent overlay inside each field, rather than just at field corners. Regardless, the industry-wide use of multi-exposure patterning schemes has pushed scanner overlay capabilities to their limits. However, it is now clear that scanner contributions may no longer be the majority component in total overlay performance. The ability to control correctable overlay components is paramount to achieving desired performance. In addition, process (non-scanner) contributions to on-product overlay error need to be aggressively tackled, though we show that there also opportunities available in active scanner alignment schemes, where appropriate scanner alignment metrology and correction can reduce residuals on product. In tandem, all these elements need to be in place to achieve the necessary overlay roadmap capability for current development efforts.

Paper Details

Date Published: 20 April 2011
PDF: 7 pages
Proc. SPIE 7971, Metrology, Inspection, and Process Control for Microlithography XXV, 79711D (20 April 2011); doi: 10.1117/12.879532
Show Author Affiliations
Nelson M. Felix, IBM Corp. (United States)
Allen H. Gabor, IBM Corp. (United States)
Vinayan C. Menon, IBM Corp. (United States)
Peter P. Longo, IBM Corp. (United States)
Scott D. Halle, IBM Corp. (United States)
Chiew-seng Koay, IBM Corp. (United States)
Matthew E. Colburn, IBM Corp. (United States)

Published in SPIE Proceedings Vol. 7971:
Metrology, Inspection, and Process Control for Microlithography XXV
Christopher J. Raymond, Editor(s)

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