Share Email Print

Proceedings Paper

Impact of polymerization process on OOB on lithographic performance of a EUV resist
Author(s): Vipul Jain; Suzanne M. Coley; Jung June Lee; Matthew D. Christianson; Daniel J. Arriola; Paul LaBeaume; Maria E. Danis; Nicolas Ortiz; Su-Jin Kang; Michael D. Wagner; Amy Kwok; David A. Valeri; James W. Thackeray
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Several approaches have been used to minimize LWR in advanced resists. Various polymer and matrix properties, such as polymer molecular volume and free volume fraction, polymer dissolution, impact of activation energy of the deprotection reaction and distribution of small molecules in the polymer matrix have been shown to influence the functional behavior of the resist. We have developed polymerization methods to improve the incorporation and homogeneity of monomers, including PAG monomer, in an EUV resist polymer. Further, we report on use of a new cation which imparts reduced OOB character and a 30% improvement in LWR for a 28nm L/S feature with sensitivity of 10mJ/cm2 versus a control containing the TPS cation. Additionally this new material is capable of 21nm resolution. We also tested the new cation for outgassing by RGA and observed a 60% reduction in outgassing versus a TPS control.

Paper Details

Date Published: 7 April 2011
PDF: 10 pages
Proc. SPIE 7969, Extreme Ultraviolet (EUV) Lithography II, 796912 (7 April 2011); doi: 10.1117/12.879487
Show Author Affiliations
Vipul Jain, Dow Electronic Materials (United States)
Suzanne M. Coley, Dow Electronic Materials (United States)
Jung June Lee, The Dow Chemical Co. (Korea, Republic of)
Matthew D. Christianson, The Dow Chemical Co. (United States)
Daniel J. Arriola, The Dow Chemical Co. (United States)
Paul LaBeaume, Dow Electronic Materials (United States)
Maria E. Danis, Dow Electronic Materials (United States)
Nicolas Ortiz, Dow Electronic Materials (United States)
Su-Jin Kang, Dow Electronic Materials (United States)
Michael D. Wagner, The Dow Chemical Co. (United States)
Amy Kwok, Dow Electronic Materials (United States)
David A. Valeri, Dow Electronic Materials (United States)
James W. Thackeray, Dow Electronic Materials (United States)

Published in SPIE Proceedings Vol. 7969:
Extreme Ultraviolet (EUV) Lithography II
Bruno M. La Fontaine; Patrick P. Naulleau, Editor(s)

© SPIE. Terms of Use
Back to Top