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Proceedings Paper

Mask registration impact on intrafield on-wafer overlay performance
Author(s): Guo-Tsai Huang; Alex Chen; Tung-Yaw Kang; S. C. Lee; Frank Laske; Klaus-Dieter Roethe; DongSub Choi; Chiang Reinhart; John C. Robinson; You Seung Jin; Lin Chua; David Tien; Venkat R. Nagaswami
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Paper Abstract

Improved overlay performance is one of the critical elements in enabling the continuing advancement of the semiconductor integrated circuit (IC) industry. With each advancing process node, additional sources of overlay error and new methods of reducing those errors need to be taken into account. We consider the impact of mask registration or pattern placement errors on intra-field on-wafer overlay performance. Mask registration data is typically minimally sampled and not well incorporated into the wafer fab overlay systems. In this work we consider mask-to-mask overlay and point out the importance of high density sampling as well as the potential for improved mask qualification and disposition.

Paper Details

Date Published: 28 March 2011
PDF: 8 pages
Proc. SPIE 7971, Metrology, Inspection, and Process Control for Microlithography XXV, 797106 (28 March 2011); doi: 10.1117/12.879485
Show Author Affiliations
Guo-Tsai Huang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Alex Chen, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Tung-Yaw Kang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
S. C. Lee, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Frank Laske, KLA-Tencor Corp. (Germany)
Klaus-Dieter Roethe, KLA-Tencor Corp. (Germany)
DongSub Choi, KLA-Tencor Corp. (Korea, Republic of)
Chiang Reinhart, KLA-Tencor Corp. (Taiwan)
John C. Robinson, KLA-Tencor Corp. (United States)
You Seung Jin, KLA-Tencor Corp. (United States)
Lin Chua, KLA-Tencor Corp. (United States)
David Tien, KLA-Tencor Corp. (United States)
Venkat R. Nagaswami, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 7971:
Metrology, Inspection, and Process Control for Microlithography XXV
Christopher J. Raymond, Editor(s)

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