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Proceedings Paper

Implementation of KrF DBARCs for implant applications on advanced lithography nodes
Author(s): Joyce Lowes; Alice Guerrero; Michael Weigand; Carlton Washburn; Charlyn Stroud; Shalini Sharma; David Torres; Mark Slezak; Gary Dabbagh; Cherry Tang
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Paper Abstract

Traditional implant layers are becoming increasingly complex in design and continuously pushing resolution limits lower. In response, developer-soluble bottom anti-reflective coatings (DBARCs) were introduced to meet these more challenging requirements. These DBARCs excelled over the traditional combination of single-layer resist and dyed resist/top anti-reflective coating (TARC). DBARCs offered the resolution and critical dimension (CD) control needed for the increasingly critical implant layers. Lithographic performance, focusing on CD control over topography and through-pitch behavior, demonstrated the inherent benefit of the DBARCs over the alternative solutions. Small-space residue testing showed the benefit of photosensitive (PS) DBARCs for cleanout of sub-100 nm trenches. A study of improved post-develop residue in various ion-implantation processes validated the use of new DBARC materials in implant layers.

Paper Details

Date Published: 16 April 2011
PDF: 10 pages
Proc. SPIE 7972, Advances in Resist Materials and Processing Technology XXVIII, 797227 (16 April 2011); doi: 10.1117/12.879464
Show Author Affiliations
Joyce Lowes, Brewer Science, Inc. (United States)
Alice Guerrero, Brewer Science, Inc. (United States)
Michael Weigand, Brewer Science, Inc. (United States)
Carlton Washburn, Brewer Science, Inc. (United States)
Charlyn Stroud, Brewer Science, Inc. (United States)
Shalini Sharma, JSR Micro, Inc. (United States)
David Torres, JSR Micro, Inc. (United States)
Mark Slezak, JSR Micro, Inc. (United States)
Gary Dabbagh, JSR Micro, Inc. (United States)
Cherry Tang, JSR Micro, Inc. (United States)


Published in SPIE Proceedings Vol. 7972:
Advances in Resist Materials and Processing Technology XXVIII
Robert D. Allen; Mark H. Somervell, Editor(s)

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