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Proceedings Paper

A new methodology for TSV array inspection
Author(s): Yoshihiko Fujimori; Takashi Tsuto; Yuji Kudo; Takeshi Inoue; Kazuya Okamoto
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Paper Abstract

A new methodology for inspection of TSV (Through Silicon Via) process wafers is developed by utilizing an optical diffraction signal from the wafers. The optical system uses telecentric illumination and has a two-dimensional sensor in order to capture the diffraction light from TSV arrays. The diffraction signal modulates the intensity of the wafer image. Furthermore, the optical configuration itself is optimized. The diffraction signal is sensitive to via-shape variations, and an abnormal via area is analyzed using the signal. Using the test wafers with deep hole patterns on silicon wafers, the performance is evaluated and the sensitivities for various pattern profile changes were confirmed. This new methodology is available for high-volume manufacturing of the future TSV-3D CMOS devices.

Paper Details

Date Published: 20 April 2011
PDF: 9 pages
Proc. SPIE 7971, Metrology, Inspection, and Process Control for Microlithography XXV, 79710I (20 April 2011); doi: 10.1117/12.879379
Show Author Affiliations
Yoshihiko Fujimori, Nikon Corp. (Japan)
Takashi Tsuto, Nikon Corp. (Japan)
Yuji Kudo, Nikon Corp. (Japan)
Takeshi Inoue, Nikon Corp. (Japan)
Kazuya Okamoto, Nikon Corp. (Japan)
Osaka Univ. (Japan)


Published in SPIE Proceedings Vol. 7971:
Metrology, Inspection, and Process Control for Microlithography XXV
Christopher J. Raymond, Editor(s)

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