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Proceedings Paper

High-order stitching overlay analysis for advanced process control
Author(s): Y. C. Pai; Charlie Chen; Louis Jang; Howard Chen; Chun-Chi Yu; Chin-Chou K. Huang; Hsing-Chien Wu; John C. Robinson; David Tien
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Paper Abstract

In recent years, layer-to-layer overlay methods moved from the linear regime into non-linear high-order methods in order to meet the shrinking overlay requirements. In this study we investigate a large number of metrology structures in the overlapped scribe-line between adjacent scanner fields and the opportunity for improved overlay performance. Sampling and modeling considerations are discussed. In this investigation we consider the opportunities for high-order stitching analysis in process control and scanner monitoring. The goal of this work is to establish a systematic methodology for high order stitching to characterize and reduce overlay errors for advanced IC manufacturing.

Paper Details

Date Published: 20 April 2011
PDF: 6 pages
Proc. SPIE 7971, Metrology, Inspection, and Process Control for Microlithography XXV, 797127 (20 April 2011); doi: 10.1117/12.879360
Show Author Affiliations
Y. C. Pai, United Microelectronics Corp. (Taiwan)
Charlie Chen, United Microelectronics Corp. (Taiwan)
Louis Jang, United Microelectronics Corp. (Taiwan)
Howard Chen, United Microelectronics Corp. (Taiwan)
Chun-Chi Yu, United Microelectronics Corp. (Taiwan)
Chin-Chou K. Huang, KLA-Tencor Corp. (United States)
Hsing-Chien Wu, KLA-Tencor Corp. (United States)
John C. Robinson, KLA-Tencor Corp. (United States)
David Tien, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 7971:
Metrology, Inspection, and Process Control for Microlithography XXV
Christopher J. Raymond, Editor(s)

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